Products containing labels are prone to bubble defects due to the protrusion of labels during the solvent-free lamination process, which seriously affects production efficiency and packaging quality. The mechanism and influence of the embedded label in the solvent-free lamination process were systematically analyzed, with a focus on introducing the triple mechanism of bubble formation: interfacial rheological instability, winding stress concentration and the escape of curing gas. To suppress the bubble defects in the solvent-free lamination process, the L9(34) orthogonal test was adopted to optimize the process parameters, and the misaligned winding mechanism was innovatively designed. This collaborative strategy effectively reduced the interlayer gap and the bubble defect rate.