Based on the analysis of the degradation mechanism of the flexible organic light-emitting devices (FOLED), a final conclusion has thus been made that the key to the improvement of FOLED’s stability lies in the effective encapsulation of the device. In of view of the encapsulation protection of the device, a review has been given of the current of the encapsulation methods and technologies. After a comparison made between the current thin film encapsulation (TFE) methods and the traditional encapsulation method adopting such rigid materials as glass or sheet metal as its substrate and encapsulation layer, it is concluded that the thin-film encapsulation (TFE) method is an effective way to achieve the flexible display as well as improve its stability of the device. The flexible organic light-emitting devices (FOLED), by adopting atomic layer deposition method to form an inorganic barrier layer coating, and by alternating inorganic and organic films to form multi-barrier encapsulation layer, helps to significantly improve the barrier properties and prolong the service life of the device. Due to its longer deposition cycle time, the device has not yet been conducive to industrial production. Thus the future research is to be focused on such issues as the improvement of the permeability of the organic thin film, the optimization of the deposition process of the inorganic barrier layer and the reduction of the production investment of the coating process.