Discussion and Analysis of the Research on Present Condition and Development Trend for Heat Spreading of Micro Heat Pipes
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摘要:
针对目前严峻的芯片热控制问题，分析了芯片散热技术的研究现状，并对未来热管技术的发展趋势进行了预测。
Abstract:
The present condition research of the technical on heat spreading in chips is analyzed aiming at the current rigorous chip heat control problem, then an estimate at the future development trend for the technical of heat pipes is carried on.